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Molded Wire Wound Chip Inductor

ETMISMDF

Product Description

Our molded wire‑wound chip inductors adopt wire‑wound structure with molded packaging, featuring precise dimensions, high Q‑value and stable performance. They are divided into signal‑type (S) and power‑type (C) for different circuit requirements. Covering multiple sizes and inductance ranges, these inductors are suitable for personal computers, peripherals, communication systems, VCD/DVD, TV circuits, buzzers, alarm systems, automotive electronic control boards and more electronic products.

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Характеристики продукта

ProductDescription

Ourmolded wire‑wound chip inductors adopt wire‑wound structure with moldedpackaging, featuring precise dimensions, high Q‑value and stable performance.They are divided into signal‑type (S) and power‑type (C) for different circuitrequirements. Covering multiple sizes and inductance ranges, these inductorsare suitable for personal computers, peripherals, communication systems,VCD/DVD, TV circuits, buzzers, alarm systems, automotive electronic controlboards and more electronic products.

Features

1. Wire‑wound surface‑mount inductor.

2. High dimensional precision.

3. High Q‑factor performance.

4. High reliability.

Applications

Personal computers, disk drives andcomputer peripherals, communication equipment, VCD, DVD, TV circuits, testingequipment, buzzers, alarm systems, automotive electronic control boards, etc.


Part Number Description

ETMISMDF 252018 - S 3R3 K

1              2        3    4    5

1. ProductType: Molded wire‑wound chip inductor

2. Dimensions:L=2.5mm, W=2.0mm, H=1.8mm

3. S – Forsignal line use; C – For power line use

4. InductanceValue: e.g. 3R3=3.3μH

5. Inductance tolerance:

"J": ±5%

"K": ±10%

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